Hot Sale for Computer Raised Floors - All Steel Anti-Static Raised Floor With HPL Covering – Senmai

Advantage

The surface is dealt with plastic spraying after phosphating, and the interior is filled with foamed cement, which has good sound-absorbing, heat insulation and fire resistance. HPL,coverings are pasted on the surface of raised floor, and conductive edge strips are inlaid around, which further strengthens the anti-static function of the floor and makes the appearance more beautiful. As a commonly used covering, HPL (melamine High Pressure Laminate ) is a hard, anti-static, and special fireproof board. It is a thermosetting resin decorative laminate made of a variety of special paper treated with phenolic and melamine resin and formed under high temperature and high pressure. HPL adopts nanotechnology in the resin to improve the features of pollution resistance, wear resistance and long-term eliminate static charges. It is a commonly used covering in the anti-static floor industry. During use, the maintenance of HPL covering is quite simple, and the surface is wear-resistant, high-temperature resistant, cleaning resistant, anti-permeable, dust-proof, shock-proof, anti-fire, flat and not easy to scratch. It is suitable for using in areas with relatively stable environment and has certain requirements for ambient temperature and humidity.

System Assembly

The pedestal is made of steel sheet, the height is adjustable, and the stringer is made of square tube. It is easy to install, and flexible to assemble. The bottom space can be used for the ventilation of air conditioning, and it is convenient to maintain. The all steel anti-static raised floor layout provides a suitable space for laying the signal line, power cord and machine ground wire system in the equipment room. Because the steel anti-static raised floor can be cut arbitrarily and the installation of accessories is convenient, it is more convenient for the laying, replacement or maintenance of equipment wiring. In addition, it can connect the wiring directly and reduce the loss of signal in the transmission process.

Parameters